• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Realization of a connection structure (20a) passing through a flexible substrate, in particular a plastic substrate, comprising: - the production of a hole passing through the thickness of the substrate, - deposit in the hole of a first conductive ink having a first viscosity, so as to form a conductive layer on at least one wall of the hole, - deposit in the hole of a second conductive ink having a second viscosity greater than the first viscosity, so as to fill the hole.
    公开号:FR3059153A1
    申请号:FR1661300
    申请日:2016-11-21
    公开日:2018-05-25
    发明作者:Mohammed Benwadih；Olivier Haon
    申请人:Commissariat a lEnergie Atomique CEA；Commissariat a lEnergie Atomique et aux Energies Alternatives CEA；
    IPC主号:
    专利说明:

    Holder (s): COMMISSIONER OF ATOMIC ENERGY AND ALTERNATIVE ENERGIES Public establishment.
    Extension request (s)
    Agent (s): BREVALEX Limited liability company.
    FR 3 059 153 - A1 (54) PROCESS FOR PRODUCING VIAS ON FLEXIBLE SUBSTRATE.
    ©) Production of a connection structure (20a) passing through a flexible substrate, in particular a plastic substrate, comprising:
    - making a hole through the thickness of the substrate,
    - deposition in the hole of a first conductive ink having a first viscosity, so as to form a conductive layer on at least one wall of the hole,
    - Deposition in the hole of a second conductive ink having a second viscosity greater than the first viscosity, so as to fill the hole.
    i
    PROCESS FOR PRODUCING VIAS ON FLEXIBLE SUBSTRATE
    DESCRIPTION
    TECHNICAL AREA AND PRIOR ART
    The present application relates to the field of circuits produced on a flexible or flexible support, in particular those formed on a plastic substrate.
    It relates more particularly to an improved method of producing an interconnection structure passing through the thickness of a flexible support and is particularly applicable in the context of the manufacture of circuits, in particular RF and / or electronic on such types supports.
    To form a conductive element passing through the thickness of a substrate, it is known to make a hole using a plasma or a laser or a chemical etching through the opening of a masking, then fill this hole with conductive material. In the field of circuits produced on a flexible support made of elastic material, in particular polymer, a conductive material is typically used in the form of liquid conductive ink to form connections.
    In such devices, filling the holes with liquid conductive ink can be a problem. When the substrate has a large thickness, this filling generally proves to be incomplete, which can lead to the implementation of conductive elements of inhomogeneous cross section and which sometimes does not entirely cross the thickness of the substrate and therefore does not lead to both sides of the support.
    The problem arises of finding a new method of making interconnections on flexible support and which is improved with respect to the drawbacks mentioned above.
    STATEMENT OF THE INVENTION
    The present invention relates to the improved production of a connection structure for a flexible or flexible substrate.
    According to one embodiment, it relates to a method comprising:
    - making one or more holes through the thickness of the substrate,
    the deposition in the hole or holes of a first conductive liquid having a first viscosity,
    - The deposition in the hole of a second conductive liquid having a second viscosity greater than the first viscosity.
    The first conductive liquid and the second conductive liquid are typically conductive inks.
    The first conductive liquid has a first viscosity, in particular a low viscosity in order to form a layer on the wall (s) of the hole (s). This conductive layer is intended to form a conductive sheath or peripheral conductive portion of conductive elements passing through the substrate. The first viscosity is typically between 0.2 and 100 mPa.s, preferably between 10 and 30 mPa.s.
    The second conductive liquid has a second viscosity greater than the first viscosity, in particular a high viscosity in order to allow filling the hole or holes and to form a central conductive portion for the conductive element or elements passing through. The second viscosity is typically between 100 and 200,000 mPa.s, advantageously between 1,000 and 40,000 mPa.s.
    The second conductive liquid and the first conductive liquid are preferably chosen so that the second viscosity is at least 10 times greater than the first viscosity and advantageously between 50 and 100 times greater than the first viscosity for filling holes with a diameter of less than 100 pm. The ratio between the second viscosity and the first viscosity can be provided on the order of 1000 for holes to be filled which have a diameter greater than 500 μm.
    The filling in two stages with liquids or inks of different viscosities makes it possible to avoid plugging of the hole or holes by the conductive ink and to allow the conductive element or elements to pass through the entire thickness of the substrate.
    This also allows an improved conductance interconnect structure to be formed.
    The flexible or flexible substrate is made of an elastic material. The term “elastic” means a material having a Young's modulus between 10 3 GPa and 5 GPa and preferably at least 20 times less than that of silicon.
    Typically, the elastic material is based on polymer.
    After formation of the hole (s) and prior to the deposition of the first conductive ink, the wall of the hole can be treated so as to increase its wettability vis-à-vis the first conductive ink.
    This treatment may include the formation of a self-assembled SAM single layer in contact with the wall of the hole.
    The self-assembled monolayer (SAM) can include thiol groups to promote the adhesion of the first ink on the wall (s) of the hole (s).
    The SAM self-assembled mono-layer can comprise silane, amine or isocyanate groups to promote adhesion of the mono-layer to the wall (s) of the hole (s), in particular when this wall is made of polymer.
    When the substrate is made of polymeric material, the formation of the SAM layer can be preceded by a treatment so as to form hydroxyl groups on the polymer. This can help promote the adhesion of the SAM layer on the wall of the hole.
    The hole or holes can be made so as to pass through the first conductive area and the second conductive area. This makes it easier to resume contact on the lower or upper face of the substrate.
    Prior to the formation of the hole (s), at least one encapsulation layer is formed on the first conductive area and / or on the second conductive area, the hole (s) being formed through the layer of encapsulation. This or these encapsulation layers can or can serve as masking for the filling conductive liquid (s) in order to protect the face of the substrate on the side of which the filling is carried out and to prevent the liquid conductive or conductive ink is deposited on unwanted regions of the device.
    Advantageously, the hole or holes is or are made by mechanical drilling. This makes it possible not to damage the walls of the holes and thus to subsequently promote the subsequent treatment of these walls in order to improve their wettability.
    Advantageously, the method applies to the implementation of interconnection structure for a device produced on flexible support and comprising at least one antenna. The first conductive area can thus be an area of the antenna circuit while the second conductive area can be an area of a ground plane arranged on the rear face of the substrate and forming an electromagnetic reflector.
    BRIEF DESCRIPTION OF THE DRAWINGS
    The present invention will be better understood on reading the description of examples of embodiments given, purely by way of indication and in no way limiting, with reference to the appended drawings in which:
    - Figures 1A-1H illustrate an example of a method of producing a connection structure passing through a flexible substrate and provided for connecting an antenna circuit to a ground plane;
    - Figures 2A-2D illustrate an alternative embodiment of the method;
    - Figure 3 illustrates a conductive element arrangement having a central portion formed of a first ink and a peripheral portion formed of a second conductive ink of lower viscosity than that of the first ink;
    Identical, similar or equivalent parts of the different figures have the same reference numerals so as to facilitate the passage from one figure to another.
    The different parts shown in the figures are not necessarily shown on a uniform scale, to make the figures more readable.
    In addition, in the description below, terms which depend on the orientation of a structure, such as "front", "rear", "upper", "lower", "lateral" etc. apply considering that the structure is oriented as illustrated in the figures.
    DETAILED PRESENTATION OF PARTICULAR EMBODIMENTS
    An example of a method for producing an interconnection structure on a flexible support as implemented according to the present invention will now be given in connection with FIGS. 1A-1H.
    In this example, the structure that is produced is used to establish an electrical connection between a ground plane and an antenna circuit provided respectively on a first face of the support and a second face of the support opposite the first face.
    The starting support (FIG. 1A) can be a flexible or flexible substrate 1, in particular of lower rigidity than that of substrates usually used in microelectronics. The flexible substrate is made of an elastic material typically based on polymer material (s) such as for example polycarbonate (PC), polyethylene (PE), polyimide (PI). The substrate 1 has a thickness e which can be for example between 10 μm and 7 mm, preferably greater than 50 μm. According to a particular example, a flexible polycarbonate substrate with a thickness of the order of 250 μm and 175 μm is used.
    First of all, a set of conductive tracks 4 forming an antenna circuit (FIG. 1B) is formed on an upper face of the substrate 1 also called “front face”. There is also produced on a lower face of the substrate 1 also called “rear face”, and which is opposite to the front face, at least one conductive zone 6 called “ground plane” (FIG. 1C). This conductive area 6 serves as a reference for the electrical potentials of the antenna circuit and can also fulfill the function of an electromagnetic reflector.
    The conductive tracks 4 and the conductive area 6 can be produced by depositing at least one conductive liquid ink, for example by means of screen printing technique, or by ink jet. The conductive ink typically comprises a solvent, a binder and conductive particles, for example metallic, and based on Ag or Ni or Au, or Cu or Pd or Pt.
    One or more holes 8a, 8b are then made passing through the thickness of the substrate 1. In the example illustrated in FIG. ID, the holes 8a, 8b are formed so as to each pass through at least one conductive track 4 'of the face upper and thus at least one conductive portion 6 'of the ground plane.
    The holes 8a, 8b may have a width W (smallest dimension measured in a plane parallel to the plane [0; x; y] of the coordinate system [0; x; y; z], the plane [0; x; y] being itself parallel to the upper face of the second layer) for example between 1 and 500 μm and a height H (dimension measured parallel to the axis z) corresponding to the thickness of the substrate. H is for example between 1 and 7 mm, and for example of the order of 175 pm or 250 pm in the case of a polycarbonate substrate as mentioned above. The through holes 8a, 8b can thus be produced with a shape ratio W / H of, for example 10 and 10 4 .
    In the case of a substrate 1 made of polymer material, chemical etching can prove to be difficult to implement, in particular in the case where the polymer is polycarbonate. Laser or plasma etching processes can prove to be long to implement and cause deterioration of the walls of the holes when the substrate 1 is made of polymer material.
    To avoid the problems mentioned above, the etching of the holes 8a, 8b can be carried out mechanically, typically using a drill with micro-drills of diameter on the order of one to several micrometers or tens of micrometers . For example, a drill with a diameter of 50 µm, or 80 µm, or 100 µm, or 150 µm, or 250 µm can be used. The mechanical drilling of the holes 8a, 8b makes it possible not to damage their wall 9 which extends throughout the thickness of the substrate 1.
    The drill used can be connected to a digital control unit or to a control circuit making it possible to control the movement of the forest as a function of position data or of coordinates determined according to the arrangement of the device in which the structure is made. 'interconnection. In this example, the position data are established as a function of the positioning of elements of the antenna circuit and of the ground plane.
    After the holes 8a, 8b have been formed and before they are filled to form conductive elements, one or more stages of treatment of the walls 9 of the holes 8a, 8b are advantageously carried out so as to increase their wettability with respect to conductive liquids. filling intended to be deposited in the holes, in particular inks comprising typically metallic conductive particles.
    A first treatment can be provided so as to form hydroxyl groups (-OH) on the respective walls 9 of the holes. This can be achieved by plasma, for example of the RIE type under oxygen O2 with a pressure between 10 and 150 mTorr, a power for example between 20 and 200 Watt, for a period which can be provided between 1 and 10 minutes. Preferably, this first treatment is carried out by means of surface treatment equipment using UV radiation and an ozone atmosphere. The duration of exposure to UV radiation can for example be between 20 and 600 seconds (FIG. 1E). It is also possible to carry out such a treatment using an aqueous solution, for example of the NaBHL type in water.
    A second treatment can then be provided so as to form a layer 11 SAM (SAM for “Self Assembled Monolayer”) on the walls 9 of the holes 8a, 8b in order to increase the adhesion at the level of the walls. conductive ink (s) caused to be deposited in the holes 8a, 8b (FIG. 1F).
    The SAM layer typically comprises groups of silane or amine or isocyanate type to allow this layer to adhere to the material of the substrate 1 made of polymer (s). In order to allow the capillarity of the conductive liquid to be improved on the walls of the holes 8a, 8b, the SAM layer 11 also typically comprises thiol-type groups, in particular when the conductive liquid brought to be deposited is a conductive ink based on particles of Ag or Cu or Ni.
    The layer 11 SAM can be for example a layer of 4-nitrobenzenethiol or of (3-Mercaptopropyl) trimethoxysilane.
    A thin conductive layer is then formed on the walls 9 of the holes 8a, 8b, by depositing a conductive liquid, in particular a conductive ink 13 (FIG. IG). This conductive ink 13 has a low viscosity which can be for example between 0.2 and 100 centipoise (in other words mPa.s), preferably between 10 and mPa.s.
    The conductive ink 13 may be based on metal particles chosen for example from Ag, Ni, Au, Cu, Pd, Pt in a solvent. According to a particular example, a conductive ink 13 based on a silver nanoparticle is used, for example of the order of 20% maximum by weight, diluted in an alcohol of the “Cabot Conductive Ink CCI-300” type sold by the company CABOT. corporation with a viscosity between 11 and 15 cP. Another commercial ink can also be used as a conductive ink based on silver nanoparticles 13 sold by the company Advanced nano Products ANP DGP 40LT-15. Such an ink has a viscosity which can be of the order of 13 cP and can be diluted in a solvent of the Triethylene glycol monoethyl ether type, the concentration by weight of silver possibly being between 30 and 35% silver.
    A thermal annealing, for example at a temperature of the order of 60 ° C for 1 minute is then carried out followed by an annealing of 100 ° C for 5 minutes in order to dry the ink and form a thin conductive layer on the walls 9.
    Next, another conductive ink 15 is deposited in the holes 8a, 8c, this time having a higher viscosity than that of the conductive ink 13 (FIG. 1H).
    The other conductive ink 15, which is more viscous, typically has a viscosity of between 100 and 200,000 centipoise cP (in other words mPa.s), preferably between 5,000 and 40,000 mPa.s. The other conductive ink 15 can also be based on metal particles chosen for example from Ag, Ni, Au, Cu, Pd, Pt and contain a thickener such as for example cellulose. According to a particular example, a conductive ink 15 of the LOCTITE® ECI 1006 E&C type sold by the company Henkel or also the HPS021 or FG32 ink sold by the company NOVACENTRIX is used.
    The use of a more viscous ink 15 this time allows filling of the central part of the holes 8a, 8b. Conductive elements are thus formed. A thermal annealing, for example at a temperature of the order of 130 ° C for 30 minutes is then carried out in order to dry the ink 15 and form a conductive central portion in the holes 8a, 8b.
    By filling the holes 8a, 8b in two stages by first using a fluid ink 13 and then an ink 15 of higher viscosity, a more homogeneous distribution of conductive material is obtained in the holes 8a, 8b and better filling of these.
    Conductive elements 20a, 20b are thus formed which pass through the thickness of the substrate 1 and each in contact with a conductive portion 4 ′ of the antenna circuit arranged on the upper face and a conductive area 6 ′ arranged on the lower face. The conductive elements 20a, 20b making it possible to establish a connection between the lower face and the upper face of the substrate 1 have a homogeneous cross section and an improved conductance.
    According to a variant of the production method described above, provision may be made to form an encapsulation layer on the upper face and / or on the lower face of the substrate 1.
    In the example illustrated in FIG. 2A, before the holes are made, a first encapsulation layer 21 is formed on the upper face of the substrate 1 allowing protection of the antenna circuit, while a second layer encapsulation 23 is deposited on the underside of the substrate 1, and protects the ground plane.
    The encapsulation layers 21, 23 can be based on a polymer, for example a polyimide and can have adhesive properties, such as for example Kapton®. Advantageously, the encapsulation layers are based on fluoro-polymer.
    Then holes 28a, 28b are formed passing through the encapsulation layers 21, 23 and the thickness of the substrate 1 (FIG. 2B). This can be achieved for example using a hole as described above in conjunction with Figure ID.
    Then, after having preferably carried out a surface preparation of the walls of the holes 28a, 28b of the type described above in connection with FIGS. 1E-1F, a first deposition of conductive ink 13 of low viscosity is carried out (FIG. 2C) , so as to form a peripheral conductive sheath or zone of conductive elements on the side wall of the holes 28a, 28b.
    During this deposition, the encapsulation layers 21, 23 serve as a protective mask to prevent inadvertent deposition of conductive ink 13 on unwanted areas of the upper face and the lower face of the substrate 1. This thus prevents ίο that the conductive ink does not spread over the antenna circuit or the ground plane, which could lead to the formation of a short circuit if necessary. Advantageously, when the encapsulation layer 21 is based on a polymer of the fluoro-polymer type making it possible to promote dewetting of the conductive ink 13 on the upper face and of the substrate 1. This contributes to better filling of ink conductive 13 in the holes 28a, 28b.
    Next, the other conductive ink 15 with a higher viscosity than that of the conductive ink 13 is deposited (FIG. 2D). This other filling makes it possible to form a central conductive portion for conductive elements 20a,
    20b crossing the substrate 1.
    An arrangement with a central conductive portion formed from the viscous conductive ink 15 and a sheath formed from the less viscous conductive ink 13 is illustrated in FIG. 3 giving a sectional view of a conductive element formed through the flexible substrate 1 .
    In order to allow easier contact, the conductive elements 20a, 20b may include one or more conductive regions 20 ', 20' 'extending respectively over the encapsulation layers 21, 23 without, however, creating a short circuit.
    In one or other of the examples of processes which have just been described,
    0 an interconnection structure is created for an antenna circuit. A method according to the invention can also be applied to the implementation of devices provided with other types of electronic circuit on flexible support.
    权利要求:
    Claims (10)
    [1" id="c-fr-0001]
    1. Method for producing a connection structure passing through a flexible substrate (1) for connecting at least a first conductive area (4 ') arranged on a first face of the substrate (1) and at least at least a second conductive area ( 6 ′) arranged on a second face of the substrate, comprising:
    - make at least one hole (8a, 8b, 28a, 28b) passing through the thickness (e) of a flexible substrate,
    - deposition in the hole of a first conductive ink (13) having a first viscosity, so as to form a conductive layer on a wall (9) of the hole, the conductive layer forming a peripheral conductive portion of a conductive element,
    - Deposition in the hole of a second conductive ink (15) having a second viscosity greater than the first viscosity, so as to produce a central conductive portion of the conductive element (20a, 20b).
    [2" id="c-fr-0002]
    2. Method according to claim 1, wherein after formation of the hole (8a, 8b, 28a, 28b) and prior to the deposition of the first conductive ink (13), the wall (9) of the hole is treated so to increase its wettability vis-à-vis the first conductive ink.
    [3" id="c-fr-0003]
    3. The method of claim 2, wherein the treatment comprises forming a self-assembled SAM monolayer in contact with the wall of the hole.
    [4" id="c-fr-0004]
    4. Method according to claim 3, in which the substrate (1) is made of polymer material and the first ink (13) is based on metallic particles, the self-assembled monolayer (SAM) comprising thiol groups to promote adhesion. of the first ink (13), the SAM self-assembled monolayer comprising silane, isocyanate amine groups to promote the adhesion of the monolayer to the polymer material of the substrate (1).
    [5" id="c-fr-0005]
    5. Method according to one of claims 3 or 4, wherein the substrate (1) is made of polymeric material, the formation of the monolayer being preceded by a treatment so as to form hydroxyl functions on the polymer.
    [6" id="c-fr-0006]
    6. Method according to one of claims 1 to 5, wherein said at least one hole (8a, 8b, 28a, 28b) is made so as to pass through the first conductive area and the second conductive area.
    [7" id="c-fr-0007]
    7. Method according to one of claims 1 to 6, wherein prior to the formation of said at least one hole (28a, 28b), at least one encapsulation layer (21, 23) is formed on the first conductive area and / or on the second conductive zone, said at least one hole being formed through the encapsulation layer.
    [8" id="c-fr-0008]
    8. Method according to one of claims 1 to 7, wherein said at least one hole is made by mechanical drilling.
    [9" id="c-fr-0009]
    9. Method according to one of claims 1 to 8, wherein the first viscosity is between 0.2 and 100 mPa.s, the second viscosity is between 100 and 200000 mPa.s and at least 10 times greater than the first viscosity .
    [10" id="c-fr-0010]
    10. Method according to one of claims 1 to 9, wherein the first conductive area is an area of an antenna circuit arranged on the front face of the substrate, the second conductive area being an area of a ground plane arranged on the rear face of the substrate and forming a reflector.
    1/2
    S.61080
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    同族专利:
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    EP3324435B1|2021-04-14|
    EP3324435A1|2018-05-23|
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    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    EP1035581A2|1999-03-10|2000-09-13|Shinko Electric Industries Co. Ltd.|Multilayer wiring board|
    US20040061234A1|2002-09-27|2004-04-01|Medtronic Minimed, Inc.|High reliability multlayer circuit substrates and methods for their formation|
    WO2006061589A1|2004-12-06|2006-06-15|Plastic Logic Limited|Electronic devices|
    US8081999B2|2004-09-14|2011-12-20|Nokia Corporation|Enhanced assisted cell change|
    WO2006058034A2|2004-11-22|2006-06-01|Intermolecular, Inc.|Molecular self-assembly in substrate processing|
    CN103369837B|2012-04-09|2016-04-06|安捷利电子科技（苏州）有限公司|Rolling catalysis slurry filling perforation also forms the double-sided flex circuit plate technique of circuit|FR3074576B1|2017-12-04|2020-01-03|Commissariat A L'energie Atomique Et Aux Energies Alternatives|THERMAL PATTERN SENSOR WITH PYROELECTRIC CAPACITY COMPRISING A SOL-GEL MATRIX AND METAL OXIDE PARTICLES|
    FR3074574B1|2017-12-04|2020-01-03|Commissariat A L'energie Atomique Et Aux Energies Alternatives|THERMAL PATTERN SENSOR WITH PYROELECTRIC CAPACITY|
    FR3074575B1|2017-12-04|2020-10-16|Commissariat Energie Atomique|PYROELECTRIC CAPACITY THERMAL PATTERN SENSOR|
    FR3074577B1|2017-12-04|2020-10-23|Commissariat Energie Atomique|THERMAL PATTERN SENSOR WITH PYROELECTRIC CAPACITY AND HARD PROTECTIVE LAYER|
    法律状态:
    2017-11-30| PLFP| Fee payment|Year of fee payment: 2 |
    2018-05-25| PLSC| Publication of the preliminary search report|Effective date: 20180525 |
    2019-11-29| PLFP| Fee payment|Year of fee payment: 4 |
    2020-11-30| PLFP| Fee payment|Year of fee payment: 5 |
    2021-11-30| PLFP| Fee payment|Year of fee payment: 6 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1661300A|FR3059153B1|2016-11-21|2016-11-21|METHOD FOR PRODUCING VIAS ON FLEXIBLE SUBSTRATE|
    FR1661300|2016-11-21|FR1661300A| FR3059153B1|2016-11-21|2016-11-21|METHOD FOR PRODUCING VIAS ON FLEXIBLE SUBSTRATE|
    US15/816,004| US10629981B2|2016-11-21|2017-11-17|Method for producing vias on flexible substrate|
    EP17202210.5A| EP3324435B1|2016-11-21|2017-11-17|Method for producing vias through a flexible substrate|
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